XPeng has unveiled a new platform architecture called the Smart Electric Platform Architecture (SEPA) 2.0. The new platform is expected to reduce the cost of development and manufacturing while shortening the R&D cycle for future models by 20%. It is also expected to cut costs for adaptations of advanced driver assistance systems (ADAS) and smart infotainment systems by 70% and 85%, respectively.
The SEPA 2.0 is a modular, interchangeable vehicle platform that will support various vehicle types, including XPeng’s upcoming G6 coupe SUV, set to debut at Auto Shanghai 2023 held at the National Exhibition and Convention Center from April 18-27.
According to Brian Gu, XPeng’s president who unveiled the new platform on Sunday, the G6 will be the first vehicle built on the SEPA 2.0 platform. Gu also stated that roughly 80% of architectural components in each upcoming model will be compatible with future models, making it easier for XPeng to add to its lineup without incurring significant costs.
XPeng’s new platform is a significant step towards cost reduction and streamlining the EV manufacturing process. The SEPA 2.0 platform’s modular design allows for efficient and standardized production, reducing the time and money needed to develop new models. Furthermore, the compatibility of components across different models will reduce the complexity and cost of manufacturing.
You can watch the full presentation below.
